http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007084661-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_063681fa0378fc501023da0bd89e4a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c |
| publicationDate | 2007-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007084661-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation, which is excellent in both electrical reliability such as moisture resistance reliability and curability. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (C). (A) Epoxy resin. (B) Phenolic resin. (C) A curing accelerator having two or more diarylphosphino groups in one molecule. [Selection figure] None |
| priorityDate | 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.