http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007081151-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2005-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30228819a8a30ef01a947beec4879214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa078e15f5cff1eafaeff7da9015848f |
| publicationDate | 2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007081151-A |
| titleOfInvention | Flexible wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a halogen-free flame-retardant adhesive composition which has a sufficient bending life even when used at a high temperature, does not generate toxic gas such as hydrogen bromide during combustion, and exhibits good flame retardancy. Providing a flexible wiring board using (A) An epoxy resin which is a glycidyl compound of a polyfunctional resin having a biphenyl skeleton and a phenol skeleton represented by the following general formula, (B) an epoxy curing agent, (C) an epoxy curing accelerator, ( D) an elastomer, (E) at least one cyclophosphazene compound and (F) an inorganic filler, and the content of (D) component is 5 to 50% by mass based on the solid content of the composition It is a flexible wiring board obtained using the flame retardant adhesive composition. [Chemical 1] (In the formula, n represents an integer of 1 to 10.) [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007224162-A |
| priorityDate | 2005-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.