http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007077439-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eb16ba9568fdd04f58d5d76d57f22389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0cefcd87c0a4f376b3f17e05bad92f1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52 |
| filingDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51ec14aa2a024e75439e3d4612286c18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78687d442832b942ea7910ec4b3a3e08 |
| publicationDate | 2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007077439-A |
| titleOfInvention | Surface metallization method of polyimide resin material |
| abstract | PROBLEM TO BE SOLVED: To improve plating deposition stability by shortening a plating operation time without facilitating deterioration and migration of insulation resistance, which is easy to make continuous processing by a process mainly composed of wet processing. Furthermore, the smoothness and adhesion of the interface between the polyimide resin film and the metal can be secured stably. SOLUTION: A pretreatment step for pretreating a polyimide resin material, an electroless plating treatment step, and a thick copper plating treatment step. (1) The pretreatment step is an organic having a carbonyl group in the molecule. Including a step of treating the surface of the polyimide resin material using a solvent and a step of treating with an alkaline aqueous solution, (2) the electroless plating treatment step is an electroless nickel plating treatment step, and (3) the thickness described above. The attached copper plating treatment step is at least one plating treatment step selected from alkaline electroless copper plating treatment and alkaline electrolytic copper plating treatment on the surface of the plating layer obtained by the electroless plating. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5461988-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10021789-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022517051-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017063160-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I656818-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009004774-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7208352-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017051496-A1 |
| priorityDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.