http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007077238-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_063681fa0378fc501023da0bd89e4a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c |
| publicationDate | 2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007077238-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation having excellent adhesion to a metal member such as a semiconductor element mounting substrate or a lead frame. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (C). (A) Epoxy resin. (B) Phenolic resin. (C) A compound having a phosphino group and a mercapto group in one molecule. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008088212-A |
| priorityDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.