http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007073643-A

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filingDate 2005-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da965d012169cde473e7e884f63ed902
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publicationDate 2007-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007073643-A
titleOfInvention Printed circuit board
abstract PROBLEM TO BE SOLVED: To provide a printed circuit board capable of effectively preventing deterioration of a conductor pattern and a short circuit between conductor patterns. [Solution] A base insulating layer 3 is formed on the metal supporting substrate 2, a conductor pattern 4 is formed on the base insulating layer 3, and a metal oxide layer 5 is formed on the surface of the conductor pattern 4 and the surface of the base insulating layer 3 by sputtering. After that, the insulating cover layer 6 covering the conductor pattern 5 is formed on the metal oxide layer 5 to obtain the suspension board with circuit 1. According to the suspension board with circuit 1, since the metal oxide layer 5 covering the conductor pattern 4 is formed by sputtering, the metal oxide layer 5 can be formed with a uniform thickness. Therefore, the metal oxide layer 5 acts sufficiently as a barrier layer for the conductor pattern 4, and can effectively prevent deterioration of the conductor pattern 4 and short circuit between the conductor patterns 4. [Selection] Figure 1
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