| abstract |
There are methods that attempt to solve the problems of corrosion and solderability on metal deposits, but there remains a need for improved methods for inhibiting corrosion and improving solderability. Methods and articles are disclosed. The method is directed to depositing a nickel duplex layer on the substrate to inhibit corrosion of the substrate and improve solderability. The substrate has a gold or gold alloy finish. [Selection figure] None |