| abstract |
In an IC card, a connection failure due to bump corrosion, resin expansion, or the like mainly caused by moisture is eliminated. [Solution] An IC card comprising an IC chip 8 and an IC module 4 formed of an antenna body electrically connected to the IC chip 8 and a moisture absorbing member 12 between the opposing sheet bases 2 and 3 via an adhesive. Set to 1. [Selection] Figure 1 |