http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007063439-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G81-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L59-00 |
filingDate | 2005-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65b6ad3a4a39e0017b4cb1d5a803bc1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a49f503b237c48c2a928778d6ca3f2a |
publicationDate | 2007-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007063439-A |
titleOfInvention | Thermosetting resin composition, thermosetting resin molding material, and cured products thereof |
abstract | PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a very fast curing speed, a thermosetting resin molding material using the same, and a cured product thereof. A novolak-type phenol resin (a), a polyacetal resin (b), a compound that releases an acidic substance having a dissociation constant pKa of 2 or less by thermal decomposition at a specific temperature and a compound (c) that decomposes at 120 ° C. or higher And a thermosetting resin composition comprising a compound (d) that decomposes at less than 120 ° C. By using the compound (d) that decomposes at a temperature lower than 120 ° C. in combination with the compound (c) that decomposes at a temperature of 120 ° C. or higher, the former alone can quickly start curing even when the decomposition temperature is high and the start of curing is slow. , Molding productivity is improved. |
priorityDate | 2005-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.