| abstract |
Disclosed is a slurry-like abrasive that can efficiently polish a glass substrate, a quartz substrate, a semiconductor device, an optical lens, a hard disk substrate, a photomask, and the like and obtain excellent surface smoothness. An average particle size is 2 nm to 300 nm, and a slurry abrasive is obtained by dispersing particles that become abrasive grains into a composite oxide composed of cerium oxide, zirconium oxide, and silicon oxide in a solvent. [Selection figure] None |