| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor capable of filling a circuit level difference by bonding a semiconductor element and a supporting member for mounting a semiconductor element such as an organic substrate at a low temperature. A semiconductor adhesive film containing (A) a thermoplastic resin, (B) an epoxy resin, and (C) a liquid phenol compound, wherein (B) is a semiconductor composed of a substantially solid epoxy resin. Solved by adhesive film. The (C) liquid phenol compound preferably contains an allyl group. [Selection figure] None |