http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059668-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_30e3d3033a789d6a8c0ad34b140b492f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2005-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_836459dc17622ce1138a2b8b0f5ff5d6 |
| publicationDate | 2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007059668-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | A low-cost manufacturing method of a semiconductor device capable of forming a highly accurate pattern using a printed resist film is provided. A printing resist film containing particle components is formed with high precision on the outer periphery of a wafer, and the wafer is thinned by removing the surface of the wafer using the mask as a mask. Thereafter, toluene 16 is sprayed from the discharge nozzle 15 and the particle removing member 19 is pressed against the outer peripheral portion of the rotating wafer 6 to remove the remaining particle component 18 of the printed resist film. By using a printing resist material containing particle components, thixotropy can be obtained and a highly accurate pattern can be formed at low cost. [Selection] Figure 8 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008027967-A |
| priorityDate | 2005-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.