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publicationDate 2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007059470-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract Provided is a semiconductor device in which a functional element having a vibrator or the like is incorporated in a functional surface, the functional element can be hermetically sealed, and can be reduced in size and thickness, and a manufacturing method thereof. A functional element 13 provided on a surface of a device substrate 11 and having a vibrator or a movable portion; a first land 12 arranged on the outer peripheral portion of the functional element 13 and provided on the surface of the device substrate 11; The bump 14 and the second land 22 are electrically connected to the circuit board 20 having the second land 22 formed so that the micro device 10 having the bump 14 provided on the first land 12 corresponds to the bump 14. Are mounted from the formation surface side of the bump 14 so as to be connected to each other, and the connection portion between the bump 14 and the second land 22 is fixed over the entire circumference of the functional element 13, and the device substrate 11 and the circuit substrate 20 are connected to each other. A sealing resin layer 27 is formed so as to seal the gap, and the hollow portion 15 is configured between the functional element 13 and the circuit board 20. [Selection] Figure 1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7033069-B2
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Total number of triples: 47.