| abstract |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developability and cured coating film performance and a photo solder resist for a printed wiring board. An alkali developable photosensitive resin composition comprising a hydrophilic polymer (A), a polyfunctional acrylate monomer (B), a photopolymerization initiator (C), and a host molecule (D) having inclusion ability, and A photo solder resist comprising the same, (D) includes cyclodextrin, and the content thereof is preferably 0.1 to 15% by weight based on the solid content of the photosensitive resin composition. [Selection figure] None |