| abstract |
PROBLEM TO BE SOLVED: To be suitably used for manufacturing a circuit board and the like, having few defects due to foam entrapment or foaming, excellent adhesion, workability, heat resistance, and resin fluidity and dielectric characteristics in GHz band The present invention provides a thermosetting resin composition excellent in the above and a typical application technique thereof. The thermosetting resin composition according to the present invention includes (A) a polyimide resin component, (B) an epoxy resin component, (C) an epoxy curing agent component, and (D) an antifoaming agent component as essential components. . As a result, there are few defects due to entrapment or foaming of the thermosetting resin composition and the cured resin after curing, and further, adhesiveness, workability, heat resistance, resin fluidity, and dielectric in the GHz band. Various characteristics such as characteristics can be imparted with good balance. [Selection figure] None |