| abstract |
[PROBLEMS] As the wafer diameter increases, the roll-off (edge fringing) of the peripheral edge of the wafer has a serious effect on the chip removal rate, and reduction of edge fringing is a major issue for silicon wafer manufacturers. It has become. Rolloff is improved by optimizing chemical components to ensure the polishing rate required in primary polishing. A polishing composition used for polishing a silicon wafer, comprising at least abrasive grains and a nitrogen-containing basic compound, wherein the abrasive grain concentration is 1 wt% or more and 10 wt% or less. [Selection] Figure 2 |