| abstract |
PROBLEM TO BE SOLVED: To provide a curable resin, a composition, and a cured product thereof, particularly excellent in workability during processing, greatly increasing thermal conductivity, heat resistance, moisture resistance, water resistance, and gas barrier properties. Provide an excellent cured product. The following general formula (1) The following general formula (1) GM 1 -PM 2 -G (1) (Where G is a glycidyl group or allyl group, M 1 and M 2 are the same or different mesogenic groups, and P is a chain organic group having a silicon content of 5% by weight or more) [Selection figure] None |