| abstract |
PROBLEM TO BE SOLVED: To provide a low dielectric material, a low dielectric plate, and a low dielectric material that can be suitably used for multilayer printed wiring boards and the like because of low dielectric constant, excellent mechanical properties, dimensional stability and heat resistance, and particularly excellent high temperature properties. A low dielectric substrate is provided. SOLUTION: A low dielectric substrate in which hollow fine particles having a single pore structure are dispersed in an insulating resin, wherein the hollow fine particles are hollow epoxy resin fine particles made of an epoxy resin, and / or an organic skeleton and an inorganic skeleton. A low dielectric material which is a hollow organic / inorganic hybrid fine particle. [Selection figure] None |