http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007047111-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-5769 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
| filingDate | 2005-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c595a615a9bff9a6dd349326b3921965 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96a19ab8851f3beed6eb00c40566c172 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c34c254570fe0778687506ab286f8e2e |
| publicationDate | 2007-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007047111-A |
| titleOfInvention | MEMS device and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To hermetically seal a sensor substrate in which a lump is movably supported via a beam in a frame with a pair of upper and lower sealing plates and detect the movable amount of the lump, thereby detecting acceleration and In a MEMS device that detects angular velocity or the like, airtightness is prevented from deteriorating. A semiconductor substrate is used for the sealing plate 21 on the side where an electrode 12 for supplying a drive signal to the mass 6 and extracting a detection signal corresponding to the movable amount of the mass 6 is provided. By utilizing this, a recess 23 is formed from the outside of the device to the electrode 12 side without completely forming a hole, and the inner wall of the recess 21 is made conductive as a low resistance region 24 by diffusion of impurities. The region 24 is an external electrode. Therefore, since no through hole is formed, chipping as occurs in a glass substrate does not occur, and a wiring structure that does not deteriorate hermeticity can be realized, and conduction defects can be suppressed, improving reliability. it can. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011106955-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8522613-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011112391-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008164586-A |
| priorityDate | 2005-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.