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publicationDate 2007-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007044733-A
titleOfInvention Soldering flux
abstract [PROBLEMS] To realize a solder paste that can be stored at room temperature for a long period of time using a flux and lead-free solder powder having good wettability and good printability of a fine pattern of a high-density circuit. At least a part of the active agent in the flux is used in the form of coated particles coated with a thermoplastic material. The coated particles of the active agent have an average particle size in the range of 0.1 to 10 μm and a 10% size of 50 by passing the emulsion of the active agent through a porous membrane (eg, porous glass membrane). It is preferable to make small particles close to monodisperse having an integrated volume particle size distribution that is 1/2 or more of the% diameter and that the 90% diameter is 1.5 times or less of the 50% diameter. [Selection] Figure 1
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