| abstract |
Provided is an electronic component built-in module that improves the embedding position accuracy of a large number of electronic components to be mounted, expands the selection range of materials for an insulating layer, and improves moisture resistance reliability and adhesive strength with an insulating substrate. For the purpose. An insulating substrate having an adhesive layer on at least one surface, a plurality of electronic components having at least electrodes on one surface, and an insulating layer formed to cover the electronic components. And the other surface of the electronic component is fixed to a predetermined position of the insulating base material 10 via the adhesive layer 20, and at least the surface of the electrode of the electronic component is exposed from the insulating layer 70, thereby incorporating the electronic component. Configure the module. [Selection] Figure 1 |