http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007039668-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 2006-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcc08200c01ad27685ba7d144bc0877d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f0c3d3e3559d87cffebb0dec057bbae |
| publicationDate | 2007-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007039668-A |
| titleOfInvention | Adhesive resin composition, multilayer printed wiring board using this adhesive resin composition, and method for producing multilayer printed wiring board |
| abstract | The present invention relates to an adhesive that can easily adjust a resin flow, can suppress the protrusion of a resin that can be generated in a layering process (heating and pressing process) of a substrate in the process of manufacturing a multilayer printed wiring board, and has good adhesiveness. It aims at providing the resin composition, the multilayer printed wiring board using this adhesive agent resin composition, and its manufacturing method. (A) a thermosetting resin, (B) a high molecular weight polyphenylene ether resin having a number average molecular weight of 80,000 to 120,000 obtained by polycondensation of one or more monocyclic phenols, (C) An elastomer in which a part of the structural unit of the main chain is cross-linked, (D) an adhesive resin composition containing an inorganic filler as an essential component, and a multilayer print using the adhesive resin composition for bonding between substrates The above-described problems have been solved by providing a wiring board and a manufacturing method thereof. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015187271-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009104107-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011512453-A |
| priorityDate | 2005-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.