| abstract |
The present invention relates to a heat-resistant resin precursor composition that improves adhesion between a film after heat curing and a metal material, particularly copper, gold, and titanium-based metals, and has little change in adhesion performance during storage at room temperature, and the same. A semiconductor device is provided. A heat-resistant resin precursor composition comprising: a) a polymer mainly composed of a structural unit represented by the following general formula (1); and b) a specific disulfide compound or thioether compound. . (M 1 is an integer of 3 to 100,000, n and o are integers of 0 to 2. p and q are integers of 0 to 4, and n + q> 0.) [Selection figure] None |