| abstract |
Provided is a method of manufacturing a wiring board and a wiring board that can improve the bonding reliability and adhesion between a conductor layer and a resin layer, realize a high density wiring pattern, and can be manufactured without using harmful substances. To do. The resin layer 12 containing the photocatalyst particles 16 is irradiated with ultraviolet light UV through a mask 26 to expose the photocatalyst particles 16 on the surface of the resin layer 12. Since the wiring pattern is formed using the photocatalyst, it is possible to increase the density of the wiring pattern. The electroconductive layer 14 is formed on the resin layer 12 by using the copper film 20 deposited by irradiating the ultraviolet light UV while being immersed in the liquid 30 as a power feeding layer. Unevenness is generated by the photocatalyst particles 16 exposed from the resin layer 12, and the conductor layer 14 can be deformed so that the unevenness can be absorbed. [Selection] Figure 2 |