| abstract |
When a capacitor interlayer insulating film is built in a circuit board or a package, the stress applied to the interface with another material in contact with the interlayer insulating film is small, and the capacitor interlayer insulating film has a high dielectric constant and excellent adhesion. A paste composition, a dielectric composition, a B-stage dielectric sheet, and a circuit board with a built-in capacitor using an interlayer insulating film obtained therefrom can be provided. (A) epoxy resin, (b) high dielectric constant inorganic particles, (c) solvent, (a) epoxy resin having one or more cyclohexane rings in the molecule, A paste composition having a viscosity of 150 Pa · s or less at 0.0125 × 10 5 Pa, and (b) an average particle diameter of the high dielectric constant inorganic particles of 0.01 μm or more and 1 μm or less. [Selection figure] None |