| abstract |
PROBLEM TO BE SOLVED: To improve the solvent removal efficiency at the time of drying when applying and drying an underfill material on a semiconductor chip in pre-applied sealing, and to shorten the drying process time. Moreover, another subject is providing the resin composition excellent in long-term pot life and flux characteristic maintenance by shortening of heating time. The resin composition of the present invention is a resin composition used for a pre-applied sealing resin, and is a thermosetting resin, a curing agent, and a good solvent property for the thermosetting resin, and It includes a first solvent that is poor in solvent with respect to the curing agent, and a second solvent having a boiling point lower than that of the first solvent. [Selection] Figure 1 |