http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007005709-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| filingDate | 2005-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e79eee36a7599f91e485a590fed998a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d967ae3b31b49bdde1f52043bde3fb71 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_678c2c59adb05598ad7d93847cd62710 |
| publicationDate | 2007-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007005709-A |
| titleOfInvention | Low thermal resistance wiring board for LED lighting device and LED lighting device |
| abstract | A low thermal resistance wiring board for an LED lighting device having excellent heat dissipation characteristics and reliability is provided. A low thermal resistance wiring board for an LED lighting device according to the present invention comprises a composite material substrate 1 made of a composite material in which a predetermined amount of silicon carbide particles are dispersed in an aluminum alloy, an insulating layer 2, and a desired wiring. Patterns 3a and 3b are stacked. The LED element 5 is fixed on the solid pattern 3 a via the conductive adhesive layer 4 and is electrically connected to the solid pattern 3 a and thermally connected to the composite material substrate 1. The upper electrode of the LED element 5 is connected to the land wiring pattern 3 b by a metal thin wire 6. The low thermal resistance wiring board for the LED lighting device of the present invention has a large thermal conductivity and a small difference in thermal expansion from the LED element and wiring pattern, so that a highly reliable LED lighting device can be obtained, and the LED element has a high density. Can be implemented. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120082865-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011007872-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1981094-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8890189-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101685231-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013030812-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011007874-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011013754-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5789512-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012038948-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5759376-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101172950-B1 |
| priorityDate | 2005-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.