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filingDate 2005-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70244cc4e91063615c5373158f9fc644
publicationDate 2007-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007002190-A
titleOfInvention Resin composition, and prepreg, substrate, and substrate with conductor foil using the same
abstract PROBLEM TO BE SOLVED: To provide a resin composition suitable for high frequency applications and capable of obtaining a substrate excellent in heat resistance, and a substrate obtained thereby. A substrate 10 with a conductive foil according to a preferred embodiment includes a substrate 12 and a conductive foil layer 14 formed on both sides thereof. The substrate 12 includes a cured product of a resin composition, and the resin composition includes a resin component including a vinylbenzyl compound, and a phosphorus compound including a reactive phosphorus compound including a phosphorus atom and a benzene ring having a vinyl group. ing. In this resin composition, the total content of phosphorus atoms contained in the phosphorus compound in the resin component and the phosphorus compound is 0.5% by mass or more, and the content of the reactive phosphorus compound with respect to 100 parts by mass of the resin component is 30 parts by mass or more. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202742-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.