| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-3221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-3223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-794 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate |
2005-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b3918f99d03e500a974b0e7ee3a1987
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_487235faedbca3a640050e695ee23be0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2089c63095c387b0b99c4f2f2b67a18 |
| publicationDate |
2007-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007002135-A |
| titleOfInvention |
Semiconductive resin composition and printed circuit board |
| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductive resin composition capable of forming a semiconductive layer capable of preventing charging without damaging an electronic component and maintaining a resin characteristic such as heat resistance, And providing a printed circuit board provided with the semiconductive layer which consists of the semiconductive resin composition. A sulfonated imide resin precursor and a conductive polymer are mixed in a solvent to prepare a semiconductive resin composition in which the sulfonated imide resin precursor and the conductive polymer are dissolved. Next, this semiconductive resin composition is applied to the surface of the cover layer 5 including the terminal portion 6 and the surface of the metal support layer 2 exposed from the cover layer 5 and the base layer 3 of the suspension board with circuit 1. After drying and forming the semiconductive layer 10, the semiconductive layer 10 formed on the surface of the metal support layer 2 exposed from the terminal portion 6 and the cover layer 5 and the base layer 3 is removed. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2523990-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007002134-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8753542-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011168951-A1 |
| priorityDate |
2005-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |