| abstract |
PROBLEM TO BE SOLVED: This invention describes and illustrates many inventions. In one aspect, the present invention relates to a MEMS device having a mechanical structure sealed in a chamber prior to final packaging, and a technique for manufacturing the same. The material that, when applied, seals the mechanical structure has one or more of the properties listed for integration. That is, it has low tensile stress, good step coverage, maintains its integrity when subsequent processes are applied, and does not significantly affect and / or adversely affect the performance characteristics of the mechanical structure in the chamber And / or facilitate integration with high performance integrated circuits. In one embodiment, the material that seals the mechanical structure is, for example, silicon (doped or undoped polycrystalline, amorphous, or porous), silicon carbide, silicon germanium, germanium, or gallium arsenide. It is. |