| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0814 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0888 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L-
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P9-04 |
| filingDate |
2004-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006525132-A |
| titleOfInvention |
Method for adding mass to a MEMS structure |
| abstract |
A proof mass (11) for a MEMS device is disclosed herein. The proof mass includes a base portion (13) made of a semiconductor material and one or more attachment portions (15) attached to the base portion via a shaft portion (21). The appendage (15) comprises a metal (17) or other material that can be disposed on the semiconductor material (19). By using a metal, the total mass of the proof mass (11) is increased without increasing the size of the proof mass compared to a proof mass of similar size made from semiconductor material only. At the same time, by joining the attachment portion (15) via the shaft portion (21), it is prevented that the CTE difference of the attachment portion is transmitted to the base portion that can contribute to the temperature error and stress is generated. |
| priorityDate |
2003-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |