| abstract |
The present invention provides a probe having a fine pitch, and a method of manufacturing the probe card, which can manufacture a probe card corresponding to a pad arrangement having a dense form or various other forms on a wafer. In the probe having a flat plate shape with a predetermined thickness, a middle part is bent, and a main body part that elastically expands and contracts by a tensile force or a compressive force acting on the upper end part and the lower end part, and a lower end part of the main body part, The connecting portion is integrally provided and fixedly supported on the substrate, and the chip portion is provided integrally with the upper end portion of the main body portion and contacts the pad of the element. |