| abstract |
The layered interface material described herein includes at least one pulse plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse plated thermally conductive material. . A plated layered interface material comprising an electrophoretic component is also disclosed herein and includes at least one pulsed plating thermally conductive material and at least one heat spreader component, wherein the electrophoretic component of the plated layered interface material is a reference layered Compared to the migration component of the interface material, it is reduced by at least 51%. Other layered interface materials described herein include a) a thermal conductor, b) a protective layer, c) a material layer that receives solder and prevents the formation of oxides, and d) a layer of solder material. . A method of forming a layered interface material is described herein: a) providing a pulsed plating heat conductive interface material; b) providing a heat spreader component; c) heat conductive interface material and heat. Physically coupling the spreader component. At least one additional layer can be bonded to the layered interface material, including a substrate layer, surface, adhesive, compliant fibrous component, or any other suitable layer, or thermal interface material. |