| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S439-912
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06727
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4092 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06716
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-1061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07342
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-10 |
| filingDate |
2003-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006507479-A |
| titleOfInvention |
Structure and manufacturing process of probe card assembly and package with wafer level spring |
| abstract |
PROBLEM TO BE SOLVED: To provide a probe card assembly which can be used for reliable interconnection with an advanced integrated circuit device. Both types of spring probe structures, both MEMS manufactured probes and thin film manufactured probes, can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of an enhanced integrated circuit probe card assembly and package assembly are disclosed in which the mechanical compatibility of this type of probe is expanded. Several embodiments of a probe card assembly are disclosed that provide compatibility when the pitch of the signal pads is dense and / or allow for a high level of parallel testing in commercially available wafer probing equipment. Yes. In some preferred embodiments, the probe card assembly structure includes separable standard components, thereby reducing assembly manufacturing costs and manufacturing time. These structures and assemblies allow high speed testing in wafer form. These probes also incorporate mechanical protection measures for both the spring tips and probe layout structures manufactured in MEMS or thin film on the substrate and integrated circuits. An alternative card assembly structure has a compliant retainer structure, such as a decal or screen that is adhesively attached to the probe chip substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102008463-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11474128-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I391671-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102164378-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008123076-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8134381-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106549450-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106549450-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101353188-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009011201-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107123611-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102189260-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107123611-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017195362-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I706139-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5079806-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021193304-A1 |
| priorityDate |
2002-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |