| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-059 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate |
2003-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006506805-A |
| titleOfInvention |
Hermetically sealed device and wafer scale method for manufacturing the same |
| abstract |
The present invention relates to an element having a sandwich structure, in which a chip having an element structure is bonded to a frame structure and a cover for preventing diffusion, and the element structure is advantageously arranged inside a sandwich structure. Is related to the format. The layer transition part of this sandwich structure is protected at the side edge by a metal coating. Feedthrough contact through the cover connects the contact on the bottom side of the cover to the connection metallization of the device structure on the chip. The through contact is sealed by a bottom metallization. |
| priorityDate |
2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |