| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0565 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2003-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006502590-A |
| titleOfInvention |
Method for manufacturing printed circuit board |
| abstract |
PROBLEM TO BE SOLVED: To provide a printed circuit board having a resistance element formed by plating, which can be plated without using a plating mask. A method of manufacturing a printed circuit board including a resistance element formed by plating, which includes the following steps (a) to (e). (A) To form a wiring pattern for an electronic circuit on a surface of a metal-coated laminate obtained by coating a polymer substrate with a metal by a printing method and an etching process, and for plating a resistive material in the wiring pattern for the electronic circuit Providing a predetermined area. (B) A process of applying a resist to the electronic circuit wiring pattern and forming an exposed region in which a part of the metal is exposed. (C) activating the exposed region to form an active region. (D) A step of stripping the resist. (E) A step of forming a resistance element by plating an active region and a wiring pattern for an electronic circuit outside the active region with a resistive material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013084816-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007262563-A |
| priorityDate |
2002-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |