http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006351504-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 2005-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41abccd6e0bf2cda9dc09aa99125a864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b063c1f4da9c9806521aaeaebd2c511c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c864f34d298c68fe4f0472d42aff25bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35ec15ada6ccb53d43abb1184878d4a2 |
| publicationDate | 2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006351504-A |
| titleOfInvention | Anisotropic conductive connector for wafer inspection and manufacturing method thereof, probe card for wafer inspection and manufacturing method thereof, and wafer inspection apparatus |
| abstract | An anisotropic conductive connector capable of surely achieving a good electrical connection state even with a wafer having a very small pitch of electrodes to be inspected, a manufacturing method thereof, a probe card, a manufacturing method thereof, and a wafer inspection Providing the device. According to the method of manufacturing an anisotropic conductive connector of the present invention, a contact member made of a metal exhibiting magnetism is disposed on the surface of a material layer for a conductive elastomer formed on a releasable support plate, and conductive. A magnetic field is applied to the material layer for the conductive elastomer in the thickness direction and a curing process is performed to form a conductive elastomer layer. The conductive elastomer layer is laser processed to remove portions other than the portion where the contact member is disposed. By doing so, a conductive portion for connection provided with a contact member is formed, and each of the conductive portions for connection is infiltrated into a material layer for an insulating portion formed so as to close the opening of the frame plate. A step of curing the material layer to form an insulating portion; [Selection] FIG. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011004996-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011004996-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011150836-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101037787-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101042374-B1 |
| priorityDate | 2004-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.