http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006350038-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eceb780949f602e62d96e646145f42b1 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate | 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7798d7827bfb0628844c2e3d35b529c1 |
publicationDate | 2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006350038-A |
titleOfInvention | Pattern formation method |
abstract | PROBLEM TO BE SOLVED: To finely shape a resist pattern after development, remove a resist residue, and form a permanent pattern such as a wiring pattern with high definition and efficiency, and further, a cross-linked portion ( Provided is a pattern forming method that achieves a high degree of compatibility between high resolution and adhesion between a substrate and a photosensitive layer without causing chipping, peeling or swelling in the cured film. The photosensitive layer in a pattern forming material having at least a photosensitive layer on a support is laminated on a substrate to be processed, the photosensitive layer is exposed and developed to form a resist pattern, and then the resist pattern is formed. A pattern forming method in which a resist pattern shaping step is performed by a dry process. [Selection] FIG. 39 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010103551-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008238715-A |
priorityDate | 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 1006.