abstract |
Provided are a photosensitive resin composition that is cured by radiation, has excellent scratch resistance and abrasion resistance, has a low refractive index, and has a low reflectance when used in an antireflection film, and a film having a cured film thereof. To do. The following general formula (1) R e Si (OR 1 ) 3 (1) (In the formula, R e represents a substituent having an epoxy group. R 1 represents a C 1 to C 4 alkyl group.) In the presence of a basic catalyst, an alkoxysilicon compound having an epoxy group represented by And a silicon compound (A) obtained by condensation, colloidal silica (B) having a nanoporous structure with a primary particle size of 1 to 200 nanometers, a trunk portion made of a hydrocarbon-based polymer, and a branch portion made of silicone. The photosensitive resin composition characterized by containing the high molecular compound (C) and photocationic polymerization initiator (D). |