| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9bb6edc6dbde32fef6abe8ea64614b12 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate |
2006-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1230a41550a74eb542b5b0a7f1b74e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_729490a7c5a8b542730eefdc45dd1c05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8097d85ad85fe9245018f96674846a7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3eb2c51972dd77fb46b16be8376068d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e226f901b9fb3eced02831c90797aab4 |
| publicationDate |
2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006344971-A |
| titleOfInvention |
Method for removing growth substrate of semiconductor light emitting device |
| abstract |
A technique for attaching an LED for packaging and removing a growth substrate of the LED is provided. A semiconductor structure formed on a growth substrate and including a light emitting layer disposed between an n-type region and a p-type region provides sufficient support for the semiconductor structure such that the growth substrate can be removed. Is attached to the carrier by a connecting part. In some embodiments, the semiconductor structure is a flip chip element. The semiconductor structure can be attached to the carrier by, for example, a metal bond that supports substantially the entire lateral extent of the semiconductor structure or by an interconnect such as a solder or gold stud bump. Underfill material that supports the semiconductor structure is introduced into every space between the interconnects. The underfill material can be a liquid that is cured to form a rigid structure. The growth substrate can then be removed without damaging the semiconductor structure. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012256810-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014049642-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010520643-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022093483-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8679891-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101524004-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022036185-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7236016-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5996871-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8853732-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010533374-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010045065-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011514688-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8536613-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8928052-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012156443-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7299537-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013506976-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101535168-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011517064-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014179569-A |
| priorityDate |
2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |