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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
filingDate 2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b
publicationDate 2006-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006335830-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good mold releasability during molding and continuous moldability and has excellent solder reflow resistance. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an inorganic filler as a main component, the (A) epoxy resin, (B) At least one of the phenolic resins contains a novolac-structured resin having a biphenylene skeleton in the main chain, and (E) 0.01% by weight or more of oxidized paraffin wax in the total epoxy resin composition % Of a butadiene-acrylonitrile copolymer (f1) having a carboxyl group and / or a butadiene-acrylonitrile copolymer having a carboxyl group and an epoxy resin (f2). Epoxy resin composition for semiconductor encapsulation, characterized in that it is contained in the epoxy resin composition in a proportion of 0.01 wt% or more and 1 wt% or less object.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011246619-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010202687-A
priorityDate 2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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