http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006335830-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
publicationDate | 2006-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006335830-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good mold releasability during molding and continuous moldability and has excellent solder reflow resistance. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an inorganic filler as a main component, the (A) epoxy resin, (B) At least one of the phenolic resins contains a novolac-structured resin having a biphenylene skeleton in the main chain, and (E) 0.01% by weight or more of oxidized paraffin wax in the total epoxy resin composition % Of a butadiene-acrylonitrile copolymer (f1) having a carboxyl group and / or a butadiene-acrylonitrile copolymer having a carboxyl group and an epoxy resin (f2). Epoxy resin composition for semiconductor encapsulation, characterized in that it is contained in the epoxy resin composition in a proportion of 0.01 wt% or more and 1 wt% or less object. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011246619-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010202687-A |
priorityDate | 2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.