| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 |
| filingDate |
2005-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a5ab6589f18ee8db507e786631911e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aeb1b08d3c2ab01babd9353cd80fd72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e68d2883fc519522589ce01817d5cf90 |
| publicationDate |
2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006324629-A |
| titleOfInvention |
Electronic component mounting structure and mounting method thereof |
| abstract |
In an electronic component mounting structure in which an electrode of an electronic component and an electrode of a substrate are connected via a conductive adhesive, even when a general-purpose Sn base metal electrode is used as the electrode of the electronic component, a high temperature environment is provided. Ensures high connection reliability in low and thermal cycle environments. In an electronic component mounting structure 100 in which an electronic component 20 is mounted on a substrate 10 and an electrode 11 of the substrate and an electrode 21 of the electronic component are connected via a conductive adhesive 30, The surface plating layer 21b which is the surface layer of the electrode 21 is formed by plating an Sn-based metal, and the plated Sn-based metal is modified by heat treatment. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016127274-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022145344-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014038066-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010510644-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10770234-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104810153-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009049308-A |
| priorityDate |
2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |