abstract |
Provided is a method for manufacturing a substrate having an electronic component incorporated therein, which can be manufactured at a low cost and with a simple process and enables early failure detection. A first step of mounting an electronic component on one side of a first metal foil, a laminate material and a second copper foil are prepared, and the laminate is formed on one side of the first metal foil on which the electronic component is mounted. A second step of arranging the material and the second copper foil in this order; a third step of pressing the first metal foil, the laminated material and the second metal foil to form a core layer; and the first metal foil And a fourth step of forming a circuit pattern on the second metal foil. [Selection] Figure 3A |