| abstract |
PROBLEM TO BE SOLVED: To form a copper plating layer having an excellent appearance, in which no stress is applied even when high current density plating is performed when forming a two-layer flexible copper clad laminate. In a method for producing a flexible copper-clad laminate in which copper is electroplated on an organic polymer resin film having a conductive seed layer on the surface to form a copper foil on the film, a conductive substrate is provided. Using an anode coated with an electrode active material mainly composed of a platinum group metal or oxide thereof, and separating the plating electrolytic cell into an anode chamber and a cathode chamber using a cation exchange membrane, and a plating bath temperature of 30 Plating is performed at a temperature not lower than ° C. and a copper plating current density of 4 to 12 A / dm 2 . [Selection figure] None |