| abstract |
Provided are a semiconductor device in which a functional element having a vibrator or the like is incorporated in a functional surface, the functional element can be hermetically sealed, and can be reduced in size and thickness, and a manufacturing method thereof. A microdevice 16 having a functional element 16a in which a first resin layer 15 in which a cavity opening 15b is formed is formed on a substrate 10 and a movable part or a vibrator is formed on a functional surface 16s. The functional surface 16s of the microdevice is mounted so as to block the cavity opening 15b and to form the cavity V with the functional surface 16s and the inner surface of the cavity opening 15b. The second resin layer (19, 21, 23, 27) is formed on the microdevice 16 and the first resin layer 15 so as to cover the surface to be removed. [Selection] Figure 1 |