| abstract |
Provided is a printed wiring board capable of obtaining a favorable hole shape even when drilling using a laser is performed even if the number of laser shots is small. SOLUTION: (A) a non-halogenated epoxy compound having two or more epoxy groups in one molecule, (B) a phenol resin curing agent obtained by modifying melamine, (C) an inorganic filler, (D) a dialkylphosphine A step of impregnating a resin composition containing an acid metal salt into a base material, followed by drying by heating to form a prepreg, a step of heating and pressing the prepreg together with a constituent material to form a laminate, A step of drilling by laser processing. [Selection figure] None |