http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006306976-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2005-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19218a83f95ab9b1567f1ed1090142fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6178d0733357ef758583e34be7c739aa |
| publicationDate | 2006-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006306976-A |
| titleOfInvention | Composite, prepreg, metal foil-clad laminate and printed wiring board manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide a composite that is sufficiently excellent in adhesion reliability and that sufficiently suppresses the occurrence of scraps such as resin powder or fiber that may drop off. The present invention also provides a prepreg, a metal foil-clad laminate, a multilayer printed wiring board using such a composite, and a method for producing the same. The composite of the present invention that solves the above problems is a composite formed by impregnating a curable resin composition into a fiber sheet, and the storage elastic modulus at 20 ° C. of the cured product of the curable resin composition. Is 100 to 2000 MPa. [Selection figure] None |
| priorityDate | 2005-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.