| abstract |
(A) Liquid epoxy resin, (B) an aromatic amine curing agent, (C) Microcapsules containing a benzoic acid derivative having a phenolic hydroxyl group represented by the general formula (2) (R 4 , R 5 and R 6 are each independently a hydrogen atom, a hydroxyl group, an alkoxy group, or a monovalent hydrocarbon group which may have an atom selected from oxygen, nitrogen, sulfur and silicon in the middle of bonding. ) A liquid epoxy resin composition containing as an essential component. [Effect] The liquid epoxy resin composition of the present invention is capable of shortening the curing time while maintaining storability, and is also a cured product having excellent adhesion to the surface of a silicon chip, particularly a photosensitive polyimide resin or a nitride film. Even if the reflow temperature after moisture absorption increases to 260 to 270 ° C., no defect occurs, and further, it does not deteriorate even under high-temperature and high-humidity conditions. A semiconductor device that does not occur can be provided. [Selection figure] None |