| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14 |
| filingDate |
2005-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19218a83f95ab9b1567f1ed1090142fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6178d0733357ef758583e34be7c739aa |
| publicationDate |
2006-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006299190-A |
| titleOfInvention |
Prepreg sheet, metal foil-clad laminate, circuit board, and method for producing multilayer printed board using them |
| abstract |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board manufacturing method capable of manufacturing a multilayer printed circuit board excellent in solder heat resistance with high production efficiency, and a prepreg sheet, a metal foil-clad laminate, and a circuit board for use therein. To do. A prepreg sheet comprising a fiber sheet and a curable resin composition impregnated therein, wherein the cured product of the curable resin composition has a storage elastic modulus at 20 ° C of 100 to 2000 MPa. [Selection] Figure 1 |
| priorityDate |
2005-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |