http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006299131-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_71213294182ef87119d9b9ee2b7bdd5f |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B42D15-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 |
| filingDate | 2005-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17e79257373cb602018304f041a97716 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af9b5bd155223248b1d08d1a2f54328a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9586706831150fb9c605d3abc6c75ce1 |
| publicationDate | 2006-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006299131-A |
| titleOfInvention | Thermosetting film adhesive composition and thermosetting film adhesive tape |
| abstract | PROBLEM TO BE SOLVED: To have a sufficient adhesive force for both an IC module material and an IC card substrate and to absorb bending stress and impact applied to the IC card with respect to the adhesion between the IC module material and the IC card substrate. A thermosetting film-like adhesive composition that can be produced more efficiently and rapidly, and can prevent deformation of the adhesive layer under high temperature, by reducing the bonding time. A thermosetting film adhesive tape is provided. SOLUTION: (A) Nitrile-butadiene rubber 32 to 75% by weight (B) Phenolic resin 24 to 65% by weight and (C) Hexamethylenetetramine 0.2 to 9% by weight (D) Plasticizer 0.1 to 20 A thermosetting characterized by forming a film having a thickness of 10 to 150 μm by dissolving a resin composition consisting of% by weight in (E) an organic solvent and then removing the organic solvent to a concentration that does not substantially remain. Type film adhesive composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018178025-A |
| priorityDate | 2005-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.