| abstract |
When manufacturing a single-channel type optical semiconductor device, especially when manufacturing a multi-channel type optical semiconductor device, the optical transmission efficiency between internal light emitting and receiving elements is reduced. Provided is a resin composition for encapsulating an optical semiconductor that can be enhanced and can prevent malfunction. The present invention relates to an optical semiconductor sealing resin composition 1 containing an epoxy resin, a curing agent, silica powder, and titanium dioxide. It further contains at least one of near-infrared absorbers, carbon, iron oxide, and alumina. A molded article having a resin thickness of 0.3 mmt obtained by molding the resin composition 1 has a light transmittance of 940 nm at a wavelength of 0.3% or less and a light reflectance of 65% or more. [Selection] Figure 1 |